MEMS aka Microelectromechanical Systems is a technology that is essential most especially to the semiconductor industry; it is designed for tiny devices as it is made up of components that are between 1 and 100 micrometers in size. It has a lot of uses particularly electronics, biotechnology, as well as in communication industry.
Fabrication of MEMS can be done through several processes, including deposition, patterning, and etching. In this article, however, we are going to focus on the etching process and its different types.
When it comes to MEMS etching, it can be done using several processes, and they can be divided into two broad categories - the wet and dry etching.
Dry etching - in this process, the material is dissolved using reactive ions or a vapor phase enchant. One advantage of this method is capable of defining small feature size that is less 100 nm). But it has a number of limitations as well such as high cost, low throughput, poor selectivity, hard to implement, and the potential for radiation damage.
Sample of dry etching
Xenon fluoride etching - primarily utilized for releasing metal and dielectric structures by undercutting silicon; this dry vapor phase isotropic etch process was first used in 1995.
Plasma etching - a dry etching process that includes the generation of reactive species, the diffusion of these species, and then adsorption. (note: etch species is also known as plasma source)
Wet etching - in this process, the material is dissolved through immersion using chemical solution inside a wet bench. It offers a number of advantages as it is easy to implement, has high etching rate, low cost, and good selectivity for most materials. However, it has some disadvantages as well such as the inadequacy for defining feature size that is less than one (1) micrometer.
Sample of wet etching
Isotropic etching - it is a process known as the non-directional removal of material from a substrate, which is done in a chemical process using substance/mixture called as etchant.
Hydrofluoric acid etching - this particular etching process utilizes aqueous etchant for silicon dioxide.
There are quite a number of processes involved in etching - each has advantages and disadvantages. One thing is certain, however - etching is part of micro fabrication that essential to the production of devices needed in the industry and society.
Fabrication of MEMS can be done through several processes, including deposition, patterning, and etching. In this article, however, we are going to focus on the etching process and its different types.
When it comes to MEMS etching, it can be done using several processes, and they can be divided into two broad categories - the wet and dry etching.
Dry etching - in this process, the material is dissolved using reactive ions or a vapor phase enchant. One advantage of this method is capable of defining small feature size that is less 100 nm). But it has a number of limitations as well such as high cost, low throughput, poor selectivity, hard to implement, and the potential for radiation damage.
Sample of dry etching
Xenon fluoride etching - primarily utilized for releasing metal and dielectric structures by undercutting silicon; this dry vapor phase isotropic etch process was first used in 1995.
Plasma etching - a dry etching process that includes the generation of reactive species, the diffusion of these species, and then adsorption. (note: etch species is also known as plasma source)
Wet etching - in this process, the material is dissolved through immersion using chemical solution inside a wet bench. It offers a number of advantages as it is easy to implement, has high etching rate, low cost, and good selectivity for most materials. However, it has some disadvantages as well such as the inadequacy for defining feature size that is less than one (1) micrometer.
Sample of wet etching
Isotropic etching - it is a process known as the non-directional removal of material from a substrate, which is done in a chemical process using substance/mixture called as etchant.
Hydrofluoric acid etching - this particular etching process utilizes aqueous etchant for silicon dioxide.
There are quite a number of processes involved in etching - each has advantages and disadvantages. One thing is certain, however - etching is part of micro fabrication that essential to the production of devices needed in the industry and society.
About the Author:
Paul Drake has had several years of experience working in a high tech facility before venturing on the Internet as a content writer. He uses his prior knowledge in writing industry-related topics, including etching process for MEMS. He also manages a personal blog of the same niche.
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